, a joint venture between NXP and Sony Corporation, has announced
it will unveil its latest security chip – the Universal Secure Access Module (U-SAM)
– at this year’s Mobile World Congress (16-19 February in Barcelona, Spain). According to the company, "the chip manages contactless smart card applications, regardless of protocols and operating systems, in Near Field Communication (NFC)-enabled mobile devices. The potential of the U-SAM will be showcased on the NTT DOCOMO stand (Stand B117, Hall 8) in a demonstration featuring how multiple applications based on different contactless technologies, can be accessed on one mobile handset."
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